Products
HDWT
Semi conductive
Shrink ratio 3:1
Co-extruded twin layer
Application up to 15kV
留言
- Basic Information
- Technical Parameter
- Ordering Data
-
Shelf life & storage:
Heat Shrink Product provided by Hongshang has a over 5 year's shelf life from date of manufacture when stored in a humidity controlled environment (-10°℃ to 40℃ and<75% relative humidity).
Ordering information:
Standard colors:
Black/Red.
Features:
Semi conductive/insulation twin layers
Co-extruded twin layer
Extra heavy wall of insulation layer
Shrink ratio 3:1
Min. full recovery temp.: 130℃
Application up to 15kV
-
Typical technical performances:
Test Items
Test Method
Test Requirements
Insulation layer
Tensile strength
ASTM D 2671
10MPa min.
Ultimate elongation
ASTM D 2671
200% min.
Volume resistivity
IEC 93
1014Ω.cm max.
Water absorption
ISO 62
0.5% max.
Semi conductive layer
Tensile strength
ASTM D 2671
12MPa min.
Ultimate elongation
ASTM D 2671
200% min.
Volume resistivity
ASTM D 257
104Ω.cm max.
-
Dimensions:
Size(mm)
As Supplied(mm)
After Recovery(mm)
Standardlength(m)
D* (Min.)
d*(Max.)
w(Min.)
36/12
36
12
5.4
1.0-1.2
45/15
45
15
5.4
1.0-1.2
55/18
55
18
5.4
1.0-1.2
65/22
65
22
6.0
1.0-1.2
73/26
73
26
6.0
1.0-1.2
85/30
85
30
6.0
1.0-1.2
95/34
95
34
6.0
1.0-1.2
100/38
100
38
6.0
1.0-1.2
115/34
115
34
6.0
1.0-1.2
120/45
120
45
6.1
1.0-1.2
D* = Inner diameter as supplied
d* = Inner diameter after fully recovered
Related products
