Products
HSCT
shrink
semi-conductive
Semi rigid
Application up to 42kV
留言
- Basic Information
- Technical Parameter
- Ordering Data
-
Shelf life & storage:
Heat Shrink Product provided by Hongshang has a over 5 year's shelf life from date of manufacture when stored in a humidity controlled environment (-10℃ to 40℃ and<75% relative humidity).
Ordering information:
Standard colors:
Black.
Features:
Semi-conductive
UV resistant
Semi rigid
Shrink ratio 3:1
Min. full recovery temp.: 120℃
Application up to 42kV
-
Typical technical performances:
Test Items
Test Method
Test Requirements
Tensile strength
ASTM D 2671
10MPa min.
Ultimate elongation
ASTM D 2671
200% min.
Tensile strength after
Aging at 150 ℃for 168hrs
ASTM D 2671
8MPa min.
Ultimate elongation after
Aging at 150℃ for 168hrs
ASTM D 2671
200% min.
Heat shock at 250℃/30min
ASTM D 2671
No cracking, dropping
Density
ASTM D 792
1.1g/cm3(nom.)
Volume resistivity
ASTM D 257
104Ω.cm max.
Low temperature flexibility
-40℃/4hrs
ASTM D 2671
No cracking
Water absorption
ISO 62
0.15% max.
-
Dimensions:
Size(mm)
As Supplied(mm)
After Recovery(mm)
Standardlength
(m)
D* (Min.)
d*(Max.)
w*(Min.)
33/8
33
8
2.4
1.0-1.5
40/12
40
12
2.5
1.0-1.5
55/16
55
16
2.8
1.0-1.5
75/22
75
22
3.0
1.0-1.5
95/25
95
25
3.1
1.0-1.5
D* = Inner diameter as supplied
d* = Inner diameter after fully recovered
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